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Samsung Galaxy F55 vs HOTWAV Cyber X Pro Rugged Phone

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Samsung Galaxy F55 Specification
HOTWAV Cyber X Pro Rugged Phone Specifcation
Realme 14 Pro Plus 5G Specification
HOTWAV Cyber 13 Pro Rugged Phone Specifcation

Samsung Galaxy F55

$323

HOTWAV Cyber X Pro Rugged Phone

$359

Realme 14 Pro Plus 5G

$417

HOTWAV Cyber 13 Pro Rugged Phone

$269

OVERVIEW

Display

Screen Size: 6.7 inches

(1080 X 2400 pixels)

120 Refresh rate

Screen Size: 6.78 inches

(1080 X 2460 pixels)

90 Refresh rate

Camera

50+8+2 MP (Triple Camera)

50 MP Selfie

4K Video

108+8+0.3 MP (Triple Camera)

16 MP Selfie

Hardware
Qualcomm SM7450-AB Snapdragon 7 Gen 1 (4 nm)
Mediatek Helio G99 (MT6789)
OS

Android 14

One UI 6.1

Android 13 Tiramisu

Battery

Li-ion 5000 mAh

Li-Po 10200 mAh

Storage
8GB RAM, 128GB
12GB RAM, 256GB
NETWORK
Technology
GSM / HSPA / LTE / 5G
GSM / HSPA / LTE
LAUNCH DATE
Announced Date
2024, May 17
-
Released Date
2024, May 27
2023, July
Status
Available
Available
DISPLAY
Type
Super AMOLED+, 1000 nits (HBM)
LCD IPS
Refresh Rate
120 Hz
90 Hz
Size

Screen Size: 6.7 inches

Surface Area: 108.4 cm²

Screen To Body Ratio: 86.4%

Screen Size: 6.78 inches

Resolution
1080 x 2400 pixels, 20:9 ratio
1080 x 2460 pixels, 21:9 ratio
Pixel Density
393 ppi
396 ppi
Always on Display
Yes
-
BODY
Dimensions

Height: 163.9 mm (6.45 inch)

Width: 76.5 mm (3.01 inch)

Height: 85.1 mm

Width: 181.8 mm

Thickness
7.8 mm (0.31 inch)
17.5 mm
Weight
180g (6.35 oz)
380g
Build
Glass front, silicone polymer (eco leather) back, plastic frame
-
SIM

Hybrid Dual SIM (Nano-SIM, dual stand-by)

Dual Sim, GSM+GSM

Resistance
-
IP68
MAIN CAMERA
Rear Camera
Triple Camera:
  • ➤ 50 MP, f/1.8, (wide), 1/1.56", 1.0µm, PDAF, OIS
  • ➤ 8 MP, f/2.2, 123˚ (ultrawide)
  • ➤ 2 MP, f/2.4, (macro)
Triple Camera:
  • ➤ 108 MP, 1/1.52", 0.70 µm
  • ➤ 8 MP, f/2.2, 1.12 µm, 1/4"
  • ➤ 0.3 MP, f/2.2
Features
LED flash, panorama, HDR
Digital zoom, Autofocus, Touch focus, Continuous shooting, Geotagging, Panorama, HDR, Face detection, Scene mode, Self-timer
Video
4K@30fps, 1080p@30/60fps, gyro-EIS, OIS
-
SELFIE CAMERA
Single
50 MP, f/2.4, (wide)
16 MP, f/2.0, 1/3.06", 1.00 µm
Video
4K@30fps, 1080p@30/60fps
-
SOFTWARE & HARDWARE
OS

Current Version: Android 14

Custom UI: One UI 6.1

Current Version: Android 13 Tiramisu

Chipset

Processor: Qualcomm SM7450-AB Snapdragon 7 Gen 1 (4 nm)

Processor: Mediatek Helio G99 (MT6789)

CPU
Octa-core (1x2.4 GHz Cortex-A710 & 3x2.36 GHz Cortex-A710 & 4x1.8 GHz Cortex-A510)
Octa-Core
GPU
Adreno 644
Mali G57 MC2
BATTERY
Type
Li-ion
Li-Po
Capacity
5000 mAh
10200 mAh
Removable
No
No
Charging

45W wired

33.0W Fast charge

STORAGE
Internal Memory
128GB 8GB RAM, 256GB 8GB RAM, 256GB 12GB RAM
256GB 12GB RAM
Card slot
microSDXC (uses shared SIM slot)
Yes , Slot for SD or second SIM card
CONNECTIVITY
WLAN
Wi-Fi 802.11 a/b/g/n/ac/6, dual-band, Wi-Fi Direct
Yes, dual-band, hotspot, Wi-Fi Direct
Bluetooth
5.2, LE, A2DP
5.0, A2DP
Positioning
GPS, GALILEO, GLONASS, BDS, QZSS
GPS, A-GPS, GLONASS, Beidou
NFC
No
Yes
Radio
No
Yes
USB
USB Type-C 2.0, OTG
USB Type C, OTG
Infrared port
No
-
SOUND
Loudspeaker
Yes, with stereo speakers
-
Sound jack
No
Yes, 3.5
PERFORMANCE
AnTuTu Score
522931 v10
-
GeekBench
953, 2391
-
SENSORS
Features
Fingerprint (under display, optical), accelerometer, gyro, proximity, compass
Fingerprint, Proximity, Light sensor, Accelerometer, Compass, Gyroscope
MISCELLANEOUS
Colors
Black, Apricot
-
Models
SM-E556B/DS, SM-E556B
-
SAR
0.93 W/kg (head)
-

Disclaimer: Information here may not be 100% accurate; please verify specs and prices on the retailer's website before buying.

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